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Senior/Principal Engineers (Advance Packaging Development)

Singapore Permanent SG$10,000 - SG$15,000 per month (SG$120,000 - SG$180,000 per year) View Job Description
This opportunity is open to candidates with expertise in wafer-level, die-level, or integration engineering, supporting cutting-edge technologies used in high-performance and memory applications.
  • Work on cutting-edge advanced packaging platforms
  • Strong technical growth in a fast-evolving space

About Our Client

Our client is a global semiconductor technology leader at the forefront of advanced memory solutions. With a strong culture of innovation, integrity, and sustainability, the organization invests heavily in next-generation process development and empowers. Engineers are trusted to own critical modules, interact directly with global stakeholders and vendors, and contribute meaningfully to next‑generation technology scaling. With a strong commitment to sustainability, integrity, and community engagement, the organization balances innovation with responsibility-creating a workplace where top technical talent can build enduring careers.

Job Description

Drive development of advanced packaging technologies across:

🔹 Wafer-Level Engineering

  • Develop and optimize wafer-level packaging processes (e.g. WLP, FO-WLP, RDL)
  • Drive process improvements in lithography, bumping, and wafer preparation
  • Enhance yield, performance, and manufacturability at wafer stage



🔹 Die-Level Engineering

  • Develop and improve assembly processes such as flip-chip, die attach, and underfill
  • Troubleshoot process issues related to alignment, bonding, and reliability
  • Drive continuous improvement in packaging performance and yield



🔹 Integration Engineering

  • Lead end-to-end process integration across wafer and die-level packaging
  • Analyze yield and reliability issues across the full packaging flow
  • Collaborate cross-functionally to ensure successful technology deployment

The Successful Applicant

  • Bachelor's, Master's, or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, or related field
  • At least 5 years of experience in semiconductor process or packaging engineering
  • Experience in advanced packaging technologies (e.g. WLP, flip-chip, assembly, integration)
  • Strong problem-solving skills and ability to work across multiple teams

What's on Offer

You will have the opportunity to work on cutting-edge advanced packaging technologies that power next-generation semiconductor products, with real impact on high-performance and memory solutions. This role offers strong technical depth and career growth, exposure to end-to-end development from wafer to final package, and the chance to collaborate with global engineering teams in a fast-evolving environment. In addition, the position comes with a competitive compensation package (including bonuses), comprehensive health and insurance coverage, and flexible benefits. You'll be part of a highly innovative and collaborative culture that values engineering excellence, while enjoying career progression opportunities, continuous learning, and the stability of a large-scale manufacturing environment driving future technology roadmaps.

Contact
Timothy Huang (Lic No: R1980928/ EA no: 18S9099)
Quote job ref
JN-062026-7047534
Phone number
+65 6416 9863

Job summary

Function
Engineering & Manufacturing
Specialisation
Engineering Design, R&D and NPI
What is your area of specialisation?
Industrial / Manufacturing
Location
Singapore
Contract Type
Permanent
Consultant name
Timothy Huang (Lic No: R1980928/ EA no: 18S9099)
Consultant contact
+65 6416 9863
Job Reference
JN-062026-7047534

Diversity & Inclusion at Michael Page

We don't just accept difference - we celebrate it. We encourage applicants from all backgrounds to apply for this role and are committed to building inclusive, diverse workplaces where everyone can thrive. If you require any support or reasonable adjustments during the recruitment process, please let us know.