Package Development Engineer (Semiconductor)

Job Description
Summary
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An established MNC organization with forward-looking culture.
High technology environment and work with experienced leaders in the semiconduct

About Our Client

A leading European multinational electronics manufacturer in the semiconductor industry, my client is the world's leading chip-maker that provides innovative semiconductor solutions for various industries.

Job Description

Under the packaging division, you will report to the Project and Package Development Manager work on product application in IoT industrial and communication or automotive industry.
As an expert in package development for back-end semiconductor application, design and develop new packaging development tools/process to improve existing process.
Support the packaging and test manufacturing division in new product development for back end assembly projects.
Using DOE knowledge, develop and qualify assembly process and solutions for BGA Ball Grid Array/Wirebonding to ensure production ramp-ups achieve or meet target expectation.
Improve wirebonding process through optimizing wirebond process in large scale assembly, including developing cost saving packages conversion for gold/copper wirebonding.
Involved in new product transfer, lead cost improvement projects (CAPEX) to continuously improve packaging processes to achieve excellent quality.
Collaborate closely with R&D division and manufacturing team, propose and implement innovative ideas to enhance manufacturability and improve production yields.
Create and implement effective controls, procedures and systems to improve yield and reduce quality defects during production process.
Implement good assembly controls with proper sustaining of processes and operation specifications.
Provide technical support through FMEA root cause analysis and SPC statistical data collection to continually troubleshoot quality issue for back end packaging development process.
Source, compare and select new equipment and specify process, operation, maintenance and safety requirements to products, materials and vendors.

The Successful Applicant

Diploma/Degree in Engineering with 3 years of working experience in back-end assembly semiconductor industry.
Candidate with prior experience in process engineering / application engineering in wirebond/ flip chip/ BGA/ EWLB/ die attach can consider applying to this role.
Knowledge in DOE, Six Sigma, SPC, Poka Yoke or other statistical tool experience would be helpful for this role.