Save Job Back to Search Job Description Summary Similar JobsWork on next-generation LED & microLED architectures.Be part of a culture that values innovation and technical excellence.About Our ClientThis organization is at the forefront of next-generation solid-state lighting and micro-display technologies. Known for pushing boundaries in LED chip design, advanced packaging, and materials innovation, the company develops high-reliability solutions for demanding global markets. With a strong focus on research, product leadership, and continuous innovation, it offers engineers an environment where cutting-edge ideas quickly translate into real, market-ready technologies.Job DescriptionPartner with business units and design teams to translate product concepts into manufacturable LED/microLED solutions.Drive end-to-end development from design → prototyping → process optimization → product qualification.Collaborate with wafer fab, assembly, reliability, materials, and packaging teams to ensure seamless integration of new technologies.Engage with global research institutes, equipment makers, and material suppliers to accelerate innovation and enhance product performance.Define and optimize process windows, SPC controls, and manufacturing design rules.Ensure processes meet Cp/Cpk requirements and deliver high reliability for HVM qualification.Deliver deep-dive characterizations, DOE reports, process specifications, and qualification documentation.Troubleshoot complex process interactions and guide teams through effective corrective & preventive actions.Identify technology gaps, improve cycle time, reduce cost, and push limits of LED/microLED integration.Serve as a subject matter expert in advanced semiconductor or LED process development.The Successful ApplicantDegree in Materials Science/Physics/Chemistry/Electrical Engineering/Mechanical Engineering or related semiconductor fields.At least 8+ years of hands-on experience in semiconductor process development, integration, or NPI.Strong technical foundation in at least one of the following:LED / microLED wafer processesInterconnect & advanced packagingFlip-chip or thermocompression bondingHybrid bonding / fine-pitch assemblyReliability & process qualificationProven track record driving new technology into manufacturing.Highly independent, analytical, and comfortable leading cross-functional technical programs.Excellent communication and problem-solving skills.Experience with microLED processing, color conversion, or mini-LED integration.Familiarity with DOE, SPC, Cp/Cpk, yield analysis, and design-for-manufacturing.What's on OfferYou'll shape the next generation of LED and microLED technologies with real global impact. You'll work alongside some of the most experienced engineers in the industry, gain access to advanced fabrication and packaging capabilities, and lead high-visibility development projects from concept to high-volume production. The company offers a stable, well-established platform with strong investment in R&D, clear technology roadmaps, and the freedom to drive meaningful technical decisions. For senior engineers, this is a rare opportunity to own breakthrough technologies, accelerate your career growth, and contribute directly to products used across automotive, consumer, and industrial markets worldwide.ContactTimothy Huang (Lic No: R1980928/ EA no: 18S9099)Quote job refJN-112025-6886277Phone number+65 6416 9863Job summaryFunctionEngineering & ManufacturingSpecialisationEngineering Design, R&D and NPIWhat is your area of specialisation?Industrial / ManufacturingLocationSingaporeContract TypePermanentConsultant nameTimothy Huang (Lic No: R1980928/ EA no: 18S9099)Consultant contact+65 6416 9863Job ReferenceJN-112025-6886277
